Quectel M66 EVB
- Extremely compact quad-band GSM/GPRS module
- Easier soldering process with LCC package
- Power consumption as low as 1.3mA
- Support Voice, Bluetooth, QuecFOTATM and Quectel OpenCPU functions
- Embedded powerful Internet service protocols, multiple Sockets & IP addresses
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Accelerate Your Learning and Design Process with the EC200A-EU Evaluation Board
Evaluation boards can greatly assist you in experimenting, testing, designing, and generally speeding up the learning and product design processes, freeing your mind from getting bogged down with peripheral technical issues. This educational board is designed for the M66 module from Quectel, allowing you to quickly set up the module and familiarize yourself with its capabilities.
Overview of M66 Module
M66 is an ultra-small quad-band GSM/GPRS module that utilizes LCC castellation packaging. This module is designed to offer optimal performance in SMS & Data transmission and audio services, even in harsh environments. Its compact size of 15.8mm × 17.7mm × 2.3mm makes it an ideal choice for applications where space is a critical factor.
Packaging and Manufacturing Benefits
The M66 module employs surface mount technology, which enhances its durability and ruggedness. The low profile and small size of the LCC package ensure that the M66 can be easily integrated into size-constrained applications, providing reliable connectivity. This packaging is particularly well-suited for large-scale manufacturing processes that demand strict cost and efficiency requirements.
Ideal Applications
The M66 module’s compact form factor, low power consumption, and extended temperature range make it an excellent choice for various Machine-to-Machine (M2M) applications. These include wearable devices, automotive systems, industrial PDAs, personal tracking devices, wireless POS systems, smart metering, telematics, and more.
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